ISSUE 5  Jan - Mar 04
Assistance Schemes
Technology for Enterprise Capability Upgrading
(T-Up)  »
 
Operation and Technology Roadmapping (OTR)  »  
Others  »
Highlights
T-Up Participating Companies  »  
Past GET-Up News  »  







Welcome to the fifth issue of our e-newsletter.

Here, we hope to share with you the latest information about our Growing Enterprises With Technology Upgrade (GET-Up) initiative. It aims to help you make the most of the advisory and financial assistance schemes that we have tailored for local enterprises in the manufacturing sector.

GET-Up results and milestones in 2003


It was an exciting and activity-packed first year for the GET-Up scheme in 2003. Although slightly short of its ambitious 500 target, GET-Up managed to visit about 450 companies in its first year, which comes up to an amazing 2 companies visited per work-day. 

Of the 450 visits, 44 companies took up the T-Up scheme, with 55 Research Scientist and Engineers (RSEs) seconded across the 44 companies. The RSEs proved to be an invaluable resource for the local companies. Most said that the scheme helped them to gain access to top researchers which was needed to push the company forward in its technology roadmap. One example is Kikuze Solutions, whose T-Up RSE, Dr. Allan Zhang, helped the company to develop a breakthrough colour calibration system – the first of its kind in the world – for digital colour printers. 

Mr. Winson Lan, CEO of Kikuze said: “ If not for T-Up, I would not have been able to gain access to Dr. Zhang. If not for T-Up, even if he knew me, Dr. Zhang would not join my company.” 

The point Mr. Lan is making is that top researchers would not normally eye positions in SMEs but instead aim for big MNCs and leading research institutes. T-Up’s 2-year secondment scheme lets RSEs get a feel of the industry without fear of losing their jobs if they wished to return after the secondment. 

In addition, there were 18 Technical advisors appointed to help 15 companies with their high-level R&D. Operation Technology Roadmapping (OTR) was also a success, with 58 companies completing OTR. Of the 450 companies visited, the majority were in the engineering segment (50%) followed by the infocomm (25%), electronics (15%) and chemical (11%) industries. 

Dr. Mike Ferrell, one of the main facilitators of OTR gave a presentation of OTR preliminary results at the end of last year. He said that the companies that took part in OTR ranged from 3 to 10,000 men companies and were generally from the manufacturing industry. He added that studies showed that companies that had completed OTR displayed significant improvements in being more attuned to market conditions.

  New chairman Prof. Chong Tow Chong leads GET-UP to the next stage  

    
GET-UP moves on to its next phase with the appointment of Prof. Chong Tow Chong as its new chairman on 1 January 2004. Prof. Chong, known for his leadership at A*STAR’s Science and Engineering Research Council, as well as the Data Storage Institute, brings with him a wealth of experience. He plans to continue with many of the good policies and practices of GET-Up, while at the same time injecting new strategies and approaches to make it even more successful. 

The current schemes of seconding researchers to companies for up to two years under T-Up, helping companies to map their technology roadmap with Operation & Technology Roadmapping (OTR) and matching leading researchers to companies under Technical Advisers Support schemes will all be maintained. The difference, however, is that Prof. Chong wants to take a more focused strategy in approaching SMEs to take up the various GET-UP schemes. 

Instead of visiting as many SMEs as possible, Prof. Chong aims to make every visit count. Last year, 450 SMEs were visited with about 58 companies going for OTR, and 44 of them latching onto the T-Up scheme. This was a good start for GET-Up, said Prof Chong. His new approach is to take a “clustering approach” to meeting up with local SMEs.  What this means is that the leading MNCs will first be identified and measures will be taken to further anchor their roots here. Then the entire value chain that supports these MNCs as well as our GLCs will be studied and those local SMEs within these chains will be the target companies for the GET-UP schemes. 

“The aim is to continue attracting and anchoring MNCs while strengthening the entire value chain,” said Prof Chong. “At the same time, we will work towards nurturing local SMEs to become future MNCs.” Singapore’s competitive edge in today’s globalised economy is its very strong manufacturing value chain – from R&D to logistics to finance and management. 

Another new initiative is the formation of industry taskforce and consortiums. Specific industries like plastic moulding and wafer technology are first identified and inter-research institute task forces are created to collaborate on identifying the future trends in these areas. Companies are then invited to form a consortium with their respective task forces to work together in charting and developing technologies that can be potential witness in the future. 

Prof Chong reiterated GET-UP’s mission to foster world-class research and develop human capital for the prosperity of Singapore. 

“The end goal is to build a knowledge-based economy for Singapore and we cannot do it without the industry’s participation.”

 

  Kikuze Solutions manages technology breakthrough with T-Up researcher  

 
Calibrating a digital colour printer to print the exact colours that were intended by the content creator is a real challenge. Every single printer (even two of the same model)  prints the same colour differently. So designers and artists often can’t get the exact colour that they want when using digital print.  Normally, they would resort to the more expensive and traditional offset printing systems to ensure colour accuracy in the prints. 

But a new technology by homegrown company Kikuze Solutions now enables digital colour printers to be able to print almost as close as to the originally intended colour. Using Kikuze’s patented Focoltone Intelligent Colour Calibration System (ICCS) 2.0, the digital colour proofing process can now take 5 minutes as compared to the colour separation techniques for traditional prints which takes 2-3 hours.  

With a shorter lead time, prints can come out faster without a loss in image colour accuracy. This increase in lead time is exemplified in the recent MTV Asia Awards, where HP managed to print 300 full-colour, offset-quality 36-page books in less than 12 hours, using Kikuze’s ICCS 2.0 technology. Typically, it would take 2-3 days to complete a job like this. 

The research on ICCS 2.0 took two years to complete, but it was the coming on board of Dr. Allan Zhang about a year ago under the T-UP scheme that changed the entire focus of coming up with an accurate colour calibration system for digital printers. With Dr.Zhang’s fresh perspective and software programming expertise, Kikuze was able to break the technology barrier and come up with an easier method to solve the colour calibration problem. Instead of the traditional focus on trying to calibrate the digital colour printers at source, Dr.Zhang looked at the print output and then compared that to a standard colour chart. The ICCS 2.0 software studies the variations between the output and the standard chart and then recalibrates the system to reduce the variations to an insignificant amount. A new page can then be printed which will then be almost as close to the original colours intended. 

Mr. Winson Lan, CEO of Kikuze, said; “This success was only possible with the T-UP scheme which helped me to get Dr.Zhang on board. We are now applying for an extension of his secondment with us so that we can develop this technology to the next level.” 

Now, Mr.Lan is looking to develop a small box device containing the ICCS 2.0 that can be attached directly to digital printers, instead of the current Adobe Photoshop plug-in solution. Later, the aim is to embed the technology into a microchip which can then be built into the printers.

IME jointly developing cutting-edge chip packaging technology.

 
A US-Singapore research programme is underway to develop new technologies that will bring the science of chip-packaging to the next level. The programme is developing nano wafer level packaging technologies which can package chips at the wafer level. Traditionally, chip-packaging is done “externally” -  square pieces of chips are cut-out or “diced” from a mini-pizza sized silicon wafer before being mounted onto external boards. The end result is that the final usable packaged chip is much larger than the actual chip itself. But with wafer level packaging, the aim is to package it on the wafer itself, which gives the packaged chip the same surface area as the chip itself. 

This programme is a joint collaboration between the Institute of Microelectronics (IME), the National University of Singapore (NUS) and the Georgia Tech Packaging Research Centre (GT), USA. Dr Mahadevan K. Iyer who heads the programme at IME said that the programme aims to develop both state-of-the-art as well as future technologies.  

“We are looking into two aspects. One is short term – what companies would need in 2-3 years. The other is longer term, what they need in 6-7 years,” said Dr. Iyer. That is why there are different phases to the project. The first is to develop 100nm wafer-level packaging technologies while the second is on 20nm wafer-level technologies. 

In addition to a smaller package footprint, wafer-level packaging can also result in lower costs, faster and more efficient manufacturing processes. At the 20nm level, traditional materials cannot withstand the stresses of such high-level manufacturing process. The solution is to turn to using nano-level particles and materials to complement the design of 20 nm wafer-level package technology.  

Over 70 researchers from the three institutions are involved in this three-year research programme which first started in 2002. To keep in touch, the researchers use video conferencing, conference calls and e-mail. Face-to-face meetings are also done several times a year. 

Dr. Iyer said that the team has already developed the prototype for two of the three implementations of the 100nm process, The next stage is to conduct reliability, yield and repeatability tests before the technology can be offered to the industry for use.  

For more information, pls contact

Tan Teck Chun
DID: 67705409
Email: teckchun@ime.a-star.edu.sg

  Exploit Technologies works to transfer technology from research to reality  

 
Helping the industry move up the value chain is what Exploit Technologies (Exploit) does best. The 2-year-old centralised research commercialisation arm of A*STAR aims to promote the technology transfer from the 12 A*STAR research institutes (RI) to the industry to help them move up the technology ladder which makes them more competitive and in turn fuels the economic growth of the nation. 

Dr. Sze Tiam Lim, senior manager of commercialisation, science & engineering division at Exploit, said that Exploit was formed to serve as a one-stop-centre for the industry to contact for search for useful technology that can benefit their business. “One advantage of this centralised service is the ability to protect, manage and bundle technologies from different RI to better serve the needs of the industry,” said Dr Sze. 

Because Exploit has a bird’s eye view of all the various research and technologies coming from the different RIs, it is in a good position to give a more holistic picture of what technology is available to the companies. Administratively, it is also easier for the companies to deal with one entity instead of multiple ones.

BIGontheNet and SQLView are just two examples of local companies that have licensed technology from the RIs – in this case the Infocommm Institute of Research, through ETPL. 

BIGontheNet is a local Internet search company that implemented several knowledge management technologies from I2R via Exploit to enable a language translation module into IPOS’s one-stop patent-search portal, reaching out to the Chinese community. SQLView is working to make their records management system solutions more attractive by licensing cutting-edge categorisation technology from I2R and turning it into a commercial product. Stephen Lim, CEO SQLView said: “One of the biggest challenges in record management systems is to have an effective categoriser; by adding this new feature to our existing product, we can become more competitive.”

Dr Sze added that ETPL has recruited a team of experts in the areas of IP management, technology intelligence and competitive intelligence, commercialisation of technology, legal, management of incubation and spin-offs. From filing patents to closing licensing deals, this team of experts has domain knowledge ranging from Chemical & Biological Sciences, to Computational, Mathematical & Physical Sciences, Electronics & Microsystems Engineering and IT & Communications. The team works closely with the RI to protect and manage their Intellectual Property and works closely with the industry to market these technologies.
Tech Offer Highlights

Flexible Organiser for Competitive Intelligence (FOCI)


Text Information Agent (TIA)

For more information, pls contact
Dr Sze Tiam Lin
Tel:  64788441

Email:  tiamlin@exploit-tech.com

  New thematic R&D funding supports industry growth in key areas  


A new R&D funding program was launched recently by A*STAR’s Science and Research Engineering Council (SERC). Called the Thematic Strategic Research Programme (TSRP), it takes on a new directed approach to supporting R&D which focuses research on areas which have been identified as “high-impact” and of significant benefit to the Singapore economy over the medium and long term. 

Dr Rajendran Thampuran, Deputy Director of SERC, said that the new thematic approach was different from the traditional “broad funding” process where proposals were open to all disciplines. 

With a thematic approach, research can lead to the creation of enabling technologies and platforms that will benefit industry clusters in terms of breadth in the diversity of applications and depth in its value chain. 

This new approach also aims to foster closer collaboration between the research community and research institutions. 

Initially, 8 potential areas of research were identified by the SERC. At eight separate workshops held last year, individual researchers gave presentations to  panels of local and overseas experts, who then submitted their reports to the TSRP steering committee. After careful study of the reports, the committee narrowed the categories to four for this year. These are Nanomanufacturing Technologies, Polymer and Molecular Electronics, Ultra WideBand (UWB) & Pervasive Computing and Industrial IT – Integrated Manufacturing and Service Systems (IMSS). 

For Nanomanufacturing, the focus is to advance knowledge and assemble capability in furthering the frontiers of semiconductor processes at 45 nanometers and beyond for high speed, low power processor applications of the future. 

UWB & Pervasive Computing aims to research into how UWB capabilities such as wide data rate spectrum, low cost, low power consumption and location-awareness can be fully realised and exploited to bring pervasive computing to the next level.

IMSS refers to the elaborate network of spare parts manufacturers, distributors and other service providers that work together to maintain the relationship with the customer and ensure the satisfactory performance of a sold product.    

As for Polymer and Molecular Electronics, the focus is on researching on plastic electronic technology to develop and integrate innovative active devices and novel material properties to create diverse electrical and optical components and subsystems.

For more information, pls visit TSRP website
or contact
Mr David Woon
Tel:  6826 6216
Email:  david_woon@a-star.edu.sg