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A Practical (t, n) Threshold Proxy Signature Scheme

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Applied Physics Letters, 86, 93102

Kah-Wee Ang, King-Jien Chui, Vladimir Bliznetsov, Chih-Hang Tung, Anyan Du, N.Balasubramanian, Ganesh Samudra, Ming Fu Li and Yee-Chia Yeo

Simultaneous Zero-tailing of Parallel Concatenated Codes

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Ballistic Emission Spectroscopy and Imaging of a Buried Metal/Organic Interface

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M Gunawan, EH Wong, SG Mhaisalkar, LT Davila, Y Hong, JFJM Caers, TK Tsai

Kinetic Analysis and Modeling of Enzymatic (R)-Phenylacetylcarbinol Batch Biotransformation Process

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An Oscillating Bubble near an Elastic Material

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Synthesis Journal 2004, pp137-150

Y.S. Cheng, D.K. Limbu and E.W. Lee

A projection Method for Molving Incompressible Viscous Flows on Domains with Moving Boundaries

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H. Pan, L.S. Pan, D. Xu, T.Y. Ng and G.R. Liu

Design and Development of Optoelectronic Mixed Signal System-on-Package

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M K Iyer, PV Ramana, K Sudharsanam, CJ Leo, M Sivakumar, Bryan SP Lee, Xie Ling

Feature-based Design in a Collaborative and Distributed Environment

Computer-Aided Design, Vol. 36(9), pp 775-797

W. D. Li, S. K. Ong, J. Y. H. Fuh, Y. S. Wong, Y. Q. Lu and A. Y. C. Nee

Nature and Elimination of Yellow-band Luminescence and the Donor-Acceptor Emission of Undoped GaN

Applied Physics Letters, 74(19): 2821-2823

G. Li, S.J. Chua, S.J., Xu, W. Wang, P. Li, B. Beaumont and P. Gibart

A Systems Modeling Methodology for Materials and Engineering Systems Design Integration

Materials & Design, Vol. 25, pp 459-469

W.F. Lu and Y.M. Deng

(R)-Binap-Mediated Asymmetric Hydrogenation with a Rhodacarborane Catalyst in Ionic-Liquid Media

Angewandte Chemie International Edition

Zhu Yinghuai, Keith Carpenter, Ching Chi Bun, Stefan Bahnmueller, Chan Pek Ke, Venugopal Shanmugham Sridevi, Leong Weng Kee, M. Frederick Hawthorne

3D Free Space Crystalline Silicon Micromirror Optical Switch

Eurosensors XVIII 2004, Rome, Italy, pp. 204 - 207

Janak Singh, Terence Gan, Ajay Agarwal, Mohanraj, Saxon Liw

A Collapsing Bubble-induced Micro-Pump Using the Jetting Effect

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B.C. Khoo, E.K. Laseboer and K.C. Hung

A Comprehensive Model for Breakdown Mechanism in HfO2 High-K Gate Stacks

IEEE IEDM, San Francisco, USA, pp. 725-728

R Ranjan (NTU),KL Pey (NTU), CH Tung (IME), L J Tang (IME), G Groeseneken (NTU), L K Bera (IME) and S De Gendr (NTU)

A DC Offset Free RF Front-End for Direct Conversion Receivers

IEEE RFIC 2004, Fort Worth, Texas, USA

Yuanjin Zheng, Shin Woei Leow, Dong Han (IME); and Yong Ping Xu (NUS)

A facile and efficient nucleophilic displacement reaction at room temperature in ionic liquids

Tetrahedron Letters

Zaher M. A. Judeh,* Hao-Yu Shen, Chi Bun Ching, Li-Chun Feng and Selvaratnam Selvasothi

A Flow Through Shear-Type Microfilter Chip for Separating Plasma and Virus Particles From Whole Bloo

The Eight International Conference of Micro TAS, Sweden

Levent Yobas, Ee-Ling Gui (NTU), Hongmiao Ji, Jing Li, Yu Chen, Wing-Cheong Hui

A New Breakdown Failure Mechanism in HfO2 Gate Dielectric

IEEE IRPS (International Reliability Physics Symposium) 2004, Phoenix Arizona, USA. pp. 347 - 352.

R Ranjan, K L Pey (NTU), L J Tang (IME), C H Tung (IME), G Groeseneken (IMEC), M K Radhakrishnan (NUS), B Kaczer (IMEC), R Degraeve (IMEC), S De Gendt (IMEC)

A New Creep Constitutive Model for Eutectic Solder Alloy

ASME Journal of Electronic Packaging, June

XQ Shi, ZP Wang, W Zhou, JHL Pang, QJ Yang

A New Efficient Suzuki Coupling Catalyst: Pd (II) Metallamacrocycle Supported Amino-Functionalised Ferrocene

14th International Symposium on Homogeneous Catalysis

Shihui Teo, Zhiqiang Weng and T.S. Andy Hor

A New Low Cost Optical Transmitter Package with Uncooled Thermal Solution and J-down Assembly

Electronic Components and Technology Conference, 27 to 30 May 2003, New Orlean, USA

Ling Xie, D Pinjala, K Sudharsanam, Ramana Pamidighantam, Mahadevan K Iyer (IME) and Eitaro Ishimura (Mitsubishi Electric Corporation, Japan)

A Novel and General Alpha-Regioselective and Highly Enantioselective Prenylation of Aldehydes

Journal of the American Chemical Society

Hin-Soon Cheng and Teck-Peng Loh

A Novel ZrO2 Preparation

The 13th International Congress on Catalysis, Paris

Yan Liu and Frits M. Dautzenberg

A Parallel Fast Fourier Transform on Multipoles (FFTM) algorithm for Electrostatics Analysis of Three-Dimensional Structures

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 23, No. 7, pp. 1063-1072

E.T. Ong, H.P. Lee and K.M. Lim

A Rational Approach to the Design and Synthesis of Chiral Organopalladium-Amine Complexes

Inorganic Chemistry

YX Li, S.Selvaratnam, J.J.Vittal, PH Leung

A Study on Effect of Stress on The Properties of Copper Lines in The Cu Interconnects

Electrochemical and Solid State Letters, pp. G68 - G71

S Balakumar (IME), R Kumar (IME), Y Shimura, K Namiki, M Fujimoto, H Toida, M Uchida and Tohru Hra (Hosei University)

A Study on the Reaction Kinetics of Dendrimerisation by FT-IR Spectroscopy: Propagation of PAMAM Dendrimer on Silica Gel

Journal of Chemical Engineering

Li Ruijiang and Bu Jie

A Study on the Reaction Kinetics of Dendrimerization by FT-IR Spectroscopy: Propagation of PAMAM Dendrimer on Silica Gel

Korean Journal of Chemical Engineering. Vol.21, No.1, pp. 98-103

R.J. Li and J. Bu

A Transmit/Receive IF Chip-Set for WDCMA Mobiles in 0.35um CMOS

IEEE Trans. On Microwave Theory and Techniques

Uday Dasgupta, Wooi Gan Yeoh, Chu Teik Tan, Sheng Jau Wong, Rajinder Singh (IME); Hiroyuki Mori (OKI Electric Industry, Japan); Masaaki Itoh (OKI Techno Centre, Singapore)

Adhesion Ehancement for Multiple Level Cu/SiLKTM Integration

2003 Materials Research Society's 2003 Spring Meeting, San Francisco, CA. pp. E2.10.1 - E2.10.6

X T Chen, D Lu, Y T Tan, Y W Chen and P D Foo (IME)

Al(2)O(3)-incorporation Effect on the Band Structure of Ba(0.5)Sr(0.5)TiO(3) Thin Films

Applied Physics Letters, 86: 112910

Y.B. Zheng, S.J. Wang, A.C.H. Huan, C.Y. Tan, L. Yan, and C.K. Ong

An Innovative and Practical Design Automation System for Progressive Dies

Proceedings of the Institution of Mechanical Engineering Part B, Journal of Engineering Manufacture

Zhang WZ, Jiang RD, Cheok BT, and Nee AYC

An On-chip Transformer-Based Feedback CMOS Power Oscillator

IEE Electronics Letters, Vol. 41, No. 3, pp. 36- 37

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Analysis of a Borderless Fab Scenario in a Distributed Simulation Testbed

Proceedings of the 2004 Winter Simulation Conference, Washington DC, USA, pp1896-1901

P. Lendermann, B.P. Gan, Y.L. Loh, H.K. Tan, S.K. Lieu, L.F. McGinnis, and J.W. Fowler

Analytical Expressions for Per-Unit-Length Parameters of

IEEE Transactions on Electromagnetic Compatibility

Ye CF and Li EP

Antiferromagnetically-coupled hard/Ru/soft layers and their applications in spin-valves

Applied Physics Letters

Wu Yihong, Li Kebin, Qiu Jinjun, Guo Zaibing, Han Guchang

Application of Ultrasound Technique in the Synthesis of Methanofullerene Derivatives

Journal of Physics and Chemistry of Solids. Vol. 65, No. 2-3, pp. 349-353

Y.H. Zhu

Area Optimization of Delay-Optimized Structures Using Intrinsic Constraint Graphs

IEEE Transactions on CAD, Vol. 23, No. 6, pp. 888-906

O. Peyran, Z. Zeng, and W.J. Zhuang

Automatic Classification of Singular Elements for the Electrostatic Analysis of Microelectromechanical Systems

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Su Y, Ong ET, and Lee KH

Cancellation Techniques in Underwater Scattering of Acoustic Signals

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C.L. Scandrett, Y.S. Shin, K.C. Hung, M.S. Khan and C.C Lilian

Cavity Pressure Measurements and Process Monitoring for Magnesium Die Casting of a Thin Wall Hand Phone Component to Improve Quality

Journal of Materials Processing Technology, October

SKK Tong, BH Hu, XP Niu, I Pinwill

Characterisation and modeling of static and cyclic relaxation in non-conductive adhesive

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M Gunawan (NTU), EH Wong, SG Mhaisalkar (NTU), LT Davila (NTU), Y Hong (NTU), JFJM Caers (Philips CFT), TK Tsai (Instron)

Characterization of Electroplated Copper Films for Three Dimensional Advanced Packaging

Journal Vacuum Science Technology B, pp. 1108 - 1113 in B 22(3)

C H Seah, G Z You, C Y Li and R Kumar (IME)

Cloud-point Temperature and Liquid-liquid Phase Separation of Concentrated Lysozyme Solution

Biophysical Chemistry. Vol.109, pp105-112

Jie Lu, Xiu-Juan Wang, Chi-Bun Ching, Keith Carpenter and Rui-Jiang Li

Comparative Studies on Alkylation of Phenol with Tert-Butyl Alcohol in the Presence of Liquid or Solid Acid Catalysts in Ionic Liquids

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Zaher M.A. Judeh, Hao-Yu Shen and Chi Bun Ching

Complexity reduction in fixed-lag smoothing for hidden Markov models

IEEE Transactions on Signal Processing

L. Shue and S. Dey

Constructing Homo- and Hetero-Metallic Molecular Topologies using

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Peili Teo, David M.J. Foo, L.L. Koh and T.S. Andy Hor

Continuously tunable microwave photonic filter design using high-birefringence linear chirped grating

IEEE Photonics Technology Letters

X. Yi, C. Lu, X. Yang, W. D. Zhong, W. Fang, L. Ding, and Y. Wang

Contrast Performance in Catalytic Ability—New Cinchona Phase Transfer Catalysts for Asymmetric Synthesis of Á-amino Acids

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Venugopal Murugapillai, Suresh P.S., Eni and Shanmugam Elango

Controlled Organization of Au Colloids into Linear Assemblies

J. Phys. Chem.. B, Vol.108, pp.18119-18123

Ziyi Zhong, Jizhong Luo, Thiam Peng Ang, James Highfield, Jianyi Lin and Aharon Gedanken

Controlled Self-Organisation of Platinium Colloids into Nano-architectures

1st Nano-Engineering and Nano-Science Congress 2004, Singapore

Ziyi Zhong, Alamelu Suriya Subramanian , Qi Hong, Han Sun , Yuanping Feng and Jianyi Lin

Correlation of Material Properties to Reliability Performance of Anisotropic Conductive Adhesive Flip Chip Packages

IEEE Components, Packaging & Manufacturing Technology, Vol 28, No. 1. pp. 157 - 164

M Teo (NTU), SG Mhaisalkar (NTU), EH Wong, PS Teo, CC Wong (NTU), K Ong (NTU), CF Goh (NTU), LK Teh (NTU)

Coupling of Simultaneous Switching Noise to Interconnecting Lines in High-Speed Systems

Jingook Kim (KAIST), Mihai D Rotaru, Kok Chin Chong, Jongbae Park (KAIST), MK Iyer, Joungho Kim (KAIST)

ECTC 2004, Las Vegas, USA. pp. 568 - 574

CoWP Capping Process for Cu Damascene Interconnection

VMIC 2004, Hawaii, USA, pp. 29 - 35

Tohru Hara (Hosei University), Kei Kinoshita (SEZ, Austria) and Subramanian Balakumar (IME)

Crystal Engineering Design of Nanoscale Hosts and Their Applications

International Symposium on Chemicals and Pharmaceuticals, in Guangzhou, China

Emily H. E. Lau, Solhe F. Alshahateet, Fathi Kooli and Pui Shan Chow

Crystallization of Amorphous Alloy during Isothermal Annealing: a Molecular Dynamics Study

Journal of Physics - Condensed Matter, Vol. 17, pp.1493-1504

Q.X. Liu, C. Lu and H.P. Lee

Defending against redirect attacks in mobile IP

Proceedings of 9th ACM Conference on Computer and Communications Security, ACM Press

R. Deng, J. Zhou, F. Bao

Degradation and failure of organic light-emitting devices

Applied Physics Letters

Ke L, Chua S.-J., Zhang K. & Yakovlev N

Delamination of Ta/SiLK(TM) in 0.13u Process Integration

VLSI Multilevel Internconnect Conference, 18 - 20 November 2002, Singapore Marriott Hotel

X T Chen, Y T Tan, Y W Chen, C Y Li, Ramana Murthy B, Navab Singh, S Balakumar and P D Foo (IME)

Dependence of Leakage Mechanism on Dielectric Barrier in Cu-SiOC Damascene Interconnects

Applied Physics Letter, pp. 2316 - 2318 in Vol. 84, No. 13

V C Ngwan and C X Zhu (NUS), Ahila Krishnamoorthy (IME)

Design and Development of Optoelectronic Mixed Signal System-on-Package (SOP)

IEEE Transactions on Advanced Packaging, Vol 27, No. 2, May 2004, pp.. 278 - 285

M K Iyer, PV Ramana, K Sudharsanam, CJ Leo, M Sivakumar, Bryan S P Lee, Xie Ling

Dopant Sources Choice for Formation of p-type ZnO: The Case of Phosphorus Compound Sources

Chemistry of Materials, Vol. 17, No. 4, pp. 852-855

Z.G. Yu, H. Gong, and P. Wu

Dry Etch and Wet Clean Process Characterization Ultra Low-k (ULK) Material Nanoglass@E

MRS Spring Meeting 2004, San Francisco, CA, USA. pp. F6.6.1 - F6.6.6 in Proceedings Vol. 812

B Ramana Murthy, Chang Chang Kuo, Ahila Krishnamoorthy, Y W Chen (IME)and Ananth Naman (Honeywell Electronic Materials)

DUV Resist Contamination for Copper/Low-K Dual Damascene Patterning

Journal of Vacuum Science and Technology B, pp. 1052 - 1059 B 22(3)

R Kumar (IME/NTU), T K S Wong (NTU), N Singh (IME), C K Chang (IME) and L Dong (IME)

Dynamic Materials Testing and Modeling of Solder Interconnects

ECTC 2004, Las Vegas, USA, pp. 1075 - 1079

Ong K C (NUS), Tan V B C (NUS), Lim C T (NUS), Wong E H and Zhang X W

Effect of Acid-Activation of Smectite Clay on the Adsorption of C16TMA Surfactants

Tokyo Conference on Nano-Structured Materials Based on Layered Inorganics, Tokyo, Japan

Fethi Kooli

Effect of Hydrogen Partial Pressure on Optoelectronic Properties of Indium Tin Oxide Thin Films Deposited by Radio Frequency Magnetron Sputtering Method

Journal of Applied Physics, 86(2):974-980

K.R. Zhang, F.R. Zhu, Huan Cha and A.T.S Wee

Effect of Process Parameters and on the AxiSymmetrical Forging of Magnesium Alloys

Journal of Materials Science and Engineering A, Vol. 381, pp 308-319

M. Chandrasekaran and M.S. Yong

Electromigration Behaviour of Dual-Damascene Cu Interconnect Structures - Structure, Width, and Length Dependences

Microelectronics Reliability, pp. 747 - 754 in 44

A V Vairagarab (IME,NTU), S G Mhaisalkara (NTU) and Ahila Krishnamoorthy (IME)

Eliminating Sidewall Damage During Etch Process for Ultra Low-K Film

Journal of Vacuum Science & Technology, pp.. 7381 - 7386, Vol. 43, No. 11A

Ramana Murthy Badam, Moitreyee Mukherjee-Roy, Wu Shaoyu (IME) and Ananth Naman (Honeywell Electronic Materials)

Enhanced Activity and Enantioselectivity of Candida Rugosa Lipase Immobilized on Macroporous Adsorptive Resins for Ibuprofen Resolution

Biotechnology Letters. Vol. 26, No. 8, pp.629-633

H.W. Yu, J.C. Wu and C.B. Ching

Enhancement of Adhesion Strength of Cu Seed Layer with Different Thickness in Cu/Low-K Multilevel Interconnects

Journal of Vacuum Science and Technology B. pp. 2384-2390

Wang Huiqi and W J Yoo (Dep of Electrical and Computer Engineering, NUS), S Balakumar (IME), C H Seah (IME), T Hara (Hosei University)

Epitaxial L10 FePt magnetic thin film sputtered on Cu (001)

Applied Physics Letters

Sun Chengjun, Chow Gan Moog (NUS), Wang Jianping

Evaluation of Commercial Elelctroless Nickel Chemicals for a Low Cost Wafer Bumping Process

Semiconductor Science and Technology

HJ Lu, LK Cheah, SCK Wong, H Gong

Evidence and Understanding of ALD HfO2-AL203 Laminate MIM Capacitors Outperforming Sandwich Counterparts

IEEE Electron Device Letters, pp. 681 683 in Vol 25, No. 10

Shi-Jin Ding, Hang Hu, Chunxiang Zhu, M F Li, S J Kim, byung Jin Cho and D S H Chan (Silicon Nano Device Lab, NUS), M B Yu, A Y Du (IME), Albert Chin and D L Kwong (University of Texas)

Fabrications of a class of nanostructured materials using carbon nanowalls as the templates

Advanced Functional Materials

Wu Yihong, Yang Bingjun (NUS), Han Guchang, Zong Baoyu, Ni Haiqiao, Luo Ping, Chong Tow Chong, Low Teck Seng, Shen Zexiang (NUS)

Field-emission induced growth of nanowires

Applied Physics Letters

J.T.L. Thong, C.H. Oon, M. Yeadon and W.D. Zhang

Finite Element Analysis of Spring-back of V-bending Sheet Metal Forming Processes

Journal of Materials Processing Technology, Vol. 148, (Electronic version)

W.M. Chan, H.I. Chew, H.P. Lee and B.T. Cheok

Flipchip Bump Integrity with Copper/Ultra Low-K Dielectrics for Fine Pitch Flip Chip Packaging

ECTC 2004, Las Vegas, USA. pp. 1636 - 1641

Seung Wook Yoon, Vaidyanathan Kripesh, Li Hong Yu, Li Chao Yong, Su Yong Ji Jefrey and Mahadevan K Iyer (IME)

Fluid Flow and Heat Transfer Characteristics of Liquid Cooled Foam Heat Sinks

ITHERM 2004, Las Vegas, USA, pp. 147 - 154

HY Zhang, D Pinjala, Y Joshi (GaTech), TN Wong (NTU), MK Iyer

Gate Dielectric Degradation Mechanism Associated with DBIE Evolution

IEEE IRPS (International Reliability Physics Symposium) 2004, Phoenix Arizona, USA, pp. 117 - 121

K L Pey (NTU), R Ranjan (NTU), C H Tung and L J Tang(IME); W H Lin (CSM) and M K Radhakrishnan (NUS)

High Performance MIM Capacitor Using ALD High K HfO2-Al2O3 Laminate Dielectrics

IEEE Electron Device Letters, pp. 730 -732 in vol. 24, no. 12

Shi-Jin Ding & M F Li (IME & NUS); Hang Hu, H F Lim, S J Kim, XF Yu, Chunxiang Zhu, Byung Jin Cho, Daniel S H Chan (NUS); Subhash C Rustagi & M B Yu (IME); Albert Chin (National Chiao Tung University); Dim-Lee Kwong (University of Texas)

Hydrogen Storage over Li-N-H Complexes

The 13th International Congress on Catalysis, Paris

J.Z. Luo, Z.Y. Zhong and J.G. Highfield

Improvement of Voltage Linearity in High k MIM Capacitors Using HfO2 SiO2 Stacked Dielectric

IEEE Electron Device Letters, pp. 538 - 540 in Vol 25, No. 8

Sun Jung Kim, B J Cho, C Zhu (NUS) and M F Li and S Jing (NUS); M B Yu and B Narayanan (IME); Albert Chin (National Chiao Tung University) and D L Kwong (University of Texas)

In Situ Formation of Ni Nanoparticles Supported on NiFe2O4 by Calcination

J of Solid State Chemistry. Vol.177, pp. 4368–4371

Fengxi Chen, Ziyi Zhong, Xiao-Jun Xu and Yuxiang Chen

In-Situ Fault Detection of Wafer Warpage in Microlithography

IEEE Transaction on Semiconductor Manufacturing. Vol. 17 No. 3

W.K. Ho, A. Tay, Y. Zhou and K. Yang

In-situ ordering of FePt thin films with fct-(001) texture on Cr100-xRux underlayer at low substrate temperature

Applied Physics Letters

Xu Yingfan, Chen Jingsheng, Wang Jianping

Industriial Crystallisation for Fine Chemicals

Advanced Powder Technology. Vol. 15 No. 6

Keith Carpenter, K.J. Wood and W.M.L.

Integrating Thick Copper/Black Diamond Layer in CMOS Interconnect Process for RF Passive Components

Microelectronics Reliability. Published in 44, page no. 581 - 585

L H Guo, Y B Zhan and Y J Su (IME)

Investigation of Annealing Effects on Indium Tin Oxide Thin Films by Electron Energy Loss Spectroscopy

Thin Solid Films, 359(2): 244-250

F.R. Zhu, Huan Cha, K.R. Zhang and A.T.S. Wee

Investigation of Electron Transport of Open Molecular Structures Based on First Principles Theory

International Journal of Nanoscience, Vol. 3, No. 4 & 5, pp. 533-540,

P. Bai, S.W Yang, E.P Li and P. Wu

Isentropic One-fluid Modelling of Unsteady Cavitating Flow

Journal of Computational Physics, Vol. 201, No. 1, pp. 80-108

T.G. Liu, B.C. Khoo and W.F. Xie

Isomerization of n-Heptane on Different Catalyst Supports

International Symposium of Catalysis and Fine Chemicals 2004, Hong-Kong

Fethi Kooli, Jeyagowry Thirugnanasampanthar, Liu Yan and Dou Jian

Kinetic Resolution of Ibuprofen Catalyzed by Candida Rugosa Lipase in Ionic Liquids

Chirality. Vol. 17, No.1, pp. 16-21

Yu Hongwei, Wu Jinchuan and Ching Chi Bun

L-Proline in Ionic Liquid as an Efficient and Reusable Catalyst for Direct Asymmetric Aldol Reaction

Tetrahedron Letters

Teck-Peng Loh, Li-Chun Feng, Hai-yan yang and Jian-Ying Yang

Laser Induced Copper Electroless Plating on Polyimide with Q-Switch Nd: YAG Laser

Applied Surface Science, November

XC Wang, ZH Zheng, GC Lim

Magnetic Nanobraids of Iron-Doped Amorphous Silica

Applied Physics Letters, pp. 5364 - 5366, vol. 85, No. 22

C X Xu and X W Sun (NTU), M B Yu and Yong Zhong Xiong (IME), Z L Dong (NTU) and J S Chen (DSI)

Measurement of Longitudinal Piezoelectric Coefficient of Thin Films by a Laser Scanning Vibrometer

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 50(2): 113 - 116

K. Yao and Feh Tay

Microfluidic Bead-Based Valve

The 16th European Conference on Solid-State Transducers, 15 - 18 September 2002, Prague, Czech Republic

Hongmiao Ji, Victor Samper, Wenmiao Shu, Qasem Ramadan, Yu Chen (IME)

Minimization of Germanium Penetration, Nanocrystal Formation, Charge Storage and Retention in a Trilayer Memory Structure with Silicon Nitride/Hafnium Dioxide Stack as the Tunnel Dielectric

Applied Physics Letters, Vol. 84, no. 22.

T H Ng (Dept of Electrical and Computer Engineering, NUS), W K Chim (Dept of Electrical and Computer Engineering,NUS), W K Choi (Dept of Electrical and Computer Engineering,NUS), V Ho (Dept of Electrical and Computer Engineering, NUS) and L W Teo (Dept of Electrical and Computer Engineering,NUS); A Y Du and C H Tung (IME)

Models for Laser Ablation of Polymers

Chemical Reviews

Boris Lukyanchuk, Nikita Bityurin, Hong Minghui, Chong Tow Chong

New Insight Into Gate Dielectric Breakdown Induced MOSFET Degradation by Novel Percolation Path Resistance Measurements

IEEE IEDM, 12 - 15 December 2004, San Francisco, USA, pp. 717-720

K L Pey (NTU), V L Lo (NTU), C H Tung (IME), W Chandra (NTU), L J Tan (IME) and R Ranjan (NTU)

Next Generation of 100-µm Pitch Wafer-Level Packaging and Assembly for Systems-on-Package

IEEE Transactions on Advanced Packaging, Vol 27, No. 2, pp. 413 - 423

AAO Tay (NUS), MK Iyer, RR Tummala (GaTech), V Kripesh, EH Wong, Swaminathan M (GaTech), CP Wong (GaTech), MD Rotaru, Doraiswami R (GaTech), Simon S Ang (Univ of Arkansas), ET Kang (NUS)

On-chip Micro-Electromagnets for Magnetic-based Bio-Molecules Separation

Journal of Magnetism and Magnetic Materials, Vol 281 (2-3), pp. 150 - 172

Qasem Ramadan, Victor Sampler (IBN), Poenar Daniel (NTU), Chen Yu

Packaging Design of Thermally Tunable Fiber Bragg Grating Sensor

ECTC 2004, Las Vegas, USA. pp. 2004 - 2008

Ling Xie, D Pinjala, K Sudharsanam, Ramana Pamidighantam, Khan O K Nava; Jingbo Zhang (DSI), Wanxun He (DSI) and Baoxi Xu (DSI)

Periodic Density Functional Theory Study of the Crystal Morphology of FeZn13

Physical Review B, Vol. 70, 165419

W.H. Zhu, H.M. Jin, P. Wu, and H.L. Liu

Phase Transitions in Lysozyme Solutions Characterised by Differential Scanning Calorimetry

Elsevier Ltd, JPCGM. 289 Vol. 46, Issue 3, of PCGCM

Jie Lu, Pui-Shan Chow and Keith Carpenter

Precise Profile Control of 3-D Lateral Junction Traps by 2-D Mask Layout and Isotropic Etching

Journal of Micromechanics and Microengineering

Levent Yobas, Rajnish Kumar Sharma, Ranganathan Nagarajan, Victor Samper (IBN), Priya d/o SR Naidu

Precision in Situ Flying Height Measurement During Track Seeking Process with Intersymbol Interference Compensation

Journal of applied physics

Wan Lei, Liu Bo and Yuan Zhimin

Prediction of Apatite lattice Constants from their Constituent Elemental Radii and Artificial Intelligence Methods

Biomaterials, Vol. 25, pp. 1123-1130

P. Wu, Y.Z. Zeng, and C.M. Wang

Preparation and Characterization of Polypseudorotaxanes Based on Block-Selected Inclusion Complexation between Poly(propylene oxide)-Poly(ethylene oxide)-Poly(propylene oxide) Triblock Copolymers and a-Cyclodextrin

Journal of the American Chemical Society

Li Jun,Ni Xiping, Zhou Zhihan, Leong Kam

Preparation and Characterization of Porous TiO2 - SiO2 Mixed Oxide

Material Research Society Symposium Proceedings. Vol. 848, FF3.25.1-FF3.25.6

Ang Thiam Peng, Zhong Ziyi and James Highfield

Preparation of Highly Dispersed Gold Catalysts for CO Oxidation

The 13th International Congress on Catalysis, Paris

Ziyi Zhong, Jizhong Luo, James Highfield, Ang Thiampeng and Jianyi Lin

Propagation of PAMAM Dendrons on Silica Gel: A Study on the A Study on the Reaction Kinetics

Macromolecules. Vol. 37, pp. pp. 6687-6694

Bu J., RuiJiang Li, Quah Chee Wee and Keith Carpenter

Recess Etching of Cu Dmascene Line Employing of Spin Etcher

VMIC 2004, Hawaii, USA, pp. 64 - 69

Kei Kinoshita (SEZ AG, Austria), Tohru Hara (Hosei University) and Subramaniam Balakumar (IME)

RF, DC and Reliability Characteristics of Atomic Layer Deposited HfO2 - Al2O3 Laminate MIM Capacitors for Si RF IC Applications

IEEE Transactions on Electron Devices, pp. 886 - 894 in Vol. 51, No. 6

Shi-Jin Ding (NUS/IME), Hang Hu, Chunxiang Zhu, Sun Jung Kim, Xiongfei Yu & Byung Jin Cho (NUS); MF Li (NUS/IME); MB Yu & Subhash C Rustagi (IME): Albert Chin (National Chiao Tung University) and Dim-Lee Kwong (University of Texas)

Rotating Multi-Layered Cylindrical Shells to Impact Loading

AIAA Journal

Gong SW and Lam KY

SiLKTM Etch Optimization and Electrical Characterization for 0.13 µm Interconnects

Journal of Microelectronics. Published in Microelectronics Reliability 45, pp 507 - 516

B Ramana Murthy, Y W Chen, A Krishnamoorthy and X T Chen (IME)

SIMS Study of Plumes Generated from Laser Ablation of Polymers

Applied Physics A, 78(4): 611-616

Z.L. Li, S.Z. Yow, L. Lui, N.L. Yakovlev, Y. Sun, E.J. Swenson and P.M. Moran

Simultaneous Based and Tool Calibration of a Self-Calibrated Modular Parallel Robot

Robotica, July

GL Yang, IM Chen, WK Lim, SH Yeo

Solid-State Stereo- and Regio- Selective Benzylic Bromination using N-Bromosuccinimide

Green Chem. Vol. 7, No. 4, pp. 207-209

A. Noman, M.M. Rahman, Reginald Tan, N. Shan and R. Bishop

Solvation forces in branched molecular liquids

R.Lim and S.J. O'Shea

Structure of Breakdown Spot During Progressive Breakdown of Ultra-Thin Gate Oxides

IEEE IRPS (International Reliability Physics Symposium) 2004, Phoenix Arizona, USA, pp. 583 - 584

F Palumbo, S Lombardo (CNR-IMM), K L Pey (NTU), L J Tang, C H Tung (IME), W H Lin (CSM), M K Radhakrishnan (NUS), G Falci (University of Catania, Italy)

Synthesis and Characterization of Mixed Co3O4/CoSO4 Oxidative Catalysts Through AOT-Intercalated CoIICoIII-Hydrotalcite Like Materials

The 13th International Congress on Catalysis, Paris

Rong Xu, Poi Cheong Tan and Hua Chun Zeng

Synthesis and Chiral Resolution of New Cyclohexyl Fused Spirobiindane 7,7'-diol

Tetrahedron Asymmetry journal. Vol. 15, Issue 21, 1 November 2004, pp. 3427-3431

Venugopal Murugapillai, Shanumugan Elango, Anbanandam Parthiban and Eni

Synthesis and the stereoelectronic properties of novel cyclopalladated complexes derived from enantiomerically pure (R/S)-N,N-dimethyl-1-(9-phenanthryl)ethylamine

Organometallics

Yongxin Li, Khim-Hui Ng, S. Selvaratnam, Geok-Kheng Tan, Jagadese J. Vittal, Pak-Hing Leung

Synthesis of Mn-salen and Mn-TACN Dendritic Catalysts for Epoxidation of Olefins

13th International Congress on catalysis, Paris, Palais des Congrès

Bu J.

Synthesis of P,N-ferrocene Ligands and Their Use as Efficient Catalysts in Suzuki Coupling Reaction of Aryl Chlorides

14th International Symposium on Homogeneous Catalysis

Zhiqiang Weng, Shihui Teo and T.S. Andy Hor

Synthesis of the Novel Ionic Liquid [N-pentylpyridinium]+[closo-CB11H12] - and Its Usage as a Reaction Medium in Catalytic Dehalogenation of Aromatic Halides

Applied Organometallic Chemistry

Yinghuai Zhu, Chi Bun Ching, Keith Carpenter, RongXu, Selvasothi Selvaratnam, Narayan S. Hosmane and John A. Maguire

Synthesis, characterization and polymerization kinetics of novel ladder-like polysilsesquioxanes containing side-chain propyl methacrylate groups

Macromolecular Chemistry and Physics

Krishnan PSG, He CB

The Contribution of Phonon Scattering to High-Resolution Images Measured by Off-axis Electron Holography

Ultramicroscopy, 98(2-4): 115-133

C.B. Boothroyd and R.E. Dunin-Borkowski

The intelligent alarm management system

IEEE Software, March/April

J Liu, KW Lim, WK Ho, KC Tan, R Srinivasan, A Tay

Thermo-mechanical Finite Element Analysis in Multi Chip Build Up Substrate Based Package Design

Microelectronics Reliability, pp. 611 - 619 in 44

Xiaowu Zhang (IME), E H Wong (IME), Charles Lee (Infineon Technologies Asia Pacific Pte Ltd), T C Chai (IME), Yiyi Ma (IME), Poi-Siong Teo (IME) D Pinjala (IME), Srinivasamurthy Sampath (IME)

UCHT-Based Complex Sequences for Asynchronous CDMA System

IEEE Transactions on Communications

S. Rahardja, W. Ser, Z.N. Lin

Vacuum Packaging Development and Testing for An Uncooled IR Bolometer Device

ECTC 2004, Las Vegas, USA, pp. 951 - 955

C S Premachandran, Chong Ser Choong, Chai TC, MK Iyer

Warpage Detection During Baking of Semiconductor Substrate in Microlithography

5th AEC/APC Conference, Dresden, Germany. pp. 608

A. Tay, W.K. Ho and Y. Zhou

Waste Minimization in the Highly Hazardous Chemical Industry

Waste Management and Recycling Techniques Conference, Kuala Lumpur

I. Halim and R. Srinivasan

Wear Analysis of Copper in Abrasive-free Chemical Mechanical Planarization

VMIC, 30 September - 2 October 2004, Marriott Hotel, Hawaii, USA. pp. 297 - 306

T Haque (NUS), S Balakumar (IME), A Senthil Kumar (NUS) and M Rahman (NUS)

Window function and interpolation algorithm for OFDM frequency-offset correction

IEEE Transactions on Vehicular Technology

R. Zhang, TT Tjhung, H.J. Hu, P.He

Wire Bonding on A Novel Immersion Gold Capped Copper Metallized Integrated Circuit

ECTC 2004, Las Vegas, USA, pp. 358 - 364

Ganesh VP, V Kripesh, Tung Chih Hang (IME); LA Lim (ASM Singapore)